PHOENIX--(BUSINESS WIRE)--Spirit Electronics, a value-added microelectronics distributor, is rolling out additional capacity for its automated BGA reballing service. Spirit’s high-efficiency ...

The SG-BGA-7064 chip socket accommodates 0.75-mm-pitch ICs with 7.286 x 10.85-mm-footprints. The devices operate in excess in 10 GHz and support dense 48-ball BGA stacked devices using ...

BGA soldering is very reliable if done using the correct procedure, so we introduce GA Soldering on PCB board, BGA Inspection and BGA Rework. According to different packaging materials, BGA components ...

Ergonomically designed, the TS-SS-11, TS-SS-12, TS-SG-01, and TS-SG-02 force-indicating compression screws promise quick and error-free chip insertion in BGA and QFN sockets with bandwidths up to 40 ...

BGA (ball grid array) packaging demand for high-pixel and large-size automotive CMOS image sensor (CIS) chips remains in high gear, but lower-end car-use CIS products processed with wafer-level chip ...

If you’re developing a performant IP-KVM based on the Raspberry Pi, an HDMI capture device that plugs into the board’s CSI port would certainly be pretty high on your list of dream peripherals. Turns ...

A trio of high-speed SigmaRAM SRAMs are being made using a 0.13-µm CMOS process that have a capacity of 18 Mb and low power consumption. The three SRAMs are known as: Double Late Write and Pipelined ...